Cuno BetaPure CMP Capsule

3M BetaPure CMP Capsule Series Filter

3M™ Betapure™ CMP filter capsules, formerly known as CUNO Optima CMP, are high capacity depth filters optimised for oxide and metal slurries used in chemical mechanical planarisation (CMP) applications.
Betapure CMP capsules are composed of all-polypropylene components and features a multi-zone “gradedporosity” design for the optimum level of particle classification.
This construction provides enhanced fl ow characteristics, including low pressure drop to minimize shearing of the slurry while providing superior service life.
The filtration of CMP slurries is a challenging process as compared to the filtration of high purity chemicals used in electronics manufacturing. High purity chemical filtration is typically performed using 0.2 micron or tighter membrane filters that have a sharp particle removal cut-off at the rated pore size.
The majority of CMP slurries contain a desired mean particle size that ranges from 0.03 to 0.2 microns.
Consequently, the filter that was specifically designed for particle clarification of high purity chemicals would strip out the desired particles and adversely affect the polishing characteristics of the CMP slurry.

Features and Benefits

• Superior removal of hard and soft gel contaminants, for reduced defectivity and improved yields
• High contaminant holding capacity reduces downtime and increases overall equipment effectiveness
• The capsules are “matched” to the slurry providing the optimum level of performance needed to dramatically reduce defect causing particles
• Provides a low pressure drop reducing the potential for l uid shear of the slurry
• Low capsule extractables, free of adhesives, binders and surfactants
• Excellent chemical compatibility with low and high pH slurries
• ISO certiied quality management system
• Manufactured and double-bagged in a clean environment to provide superior downstream cleanliness out of the package
• Provides a consistent quality of slurry enabling repeatability of the planarization process
• Rapid installation
• Reduced downtime
• Reduced handling of hazardous chemicals

Operation Conditions

• Maximum operating Temperature 40°C (104°F)
• Maximum Pressure Differential 5.2 bar (75 psi)

Typical Applications

• Semiconductor
• Data storage
• Data transmission
• Compound semiconductor

Data may be subject to change without any further notice.